A platform for research: civil engineering, architecture and urbanism
Effects of Thermal Deformation of Multi-Wire Saw's Wire Guides and Ingot on Slicing Accuracy
Effects of Thermal Deformation of Multi-Wire Saw's Wire Guides and Ingot on Slicing Accuracy
Effects of Thermal Deformation of Multi-Wire Saw's Wire Guides and Ingot on Slicing Accuracy
Abe, Y. (author) / Ishikawa, K. (author) / Suwabe, H. (author)
KEY ENGINEERING MATERIALS ; 389/390 ; 442-447
2009-01-01
6 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
High-Speed Slicing of SiC Ingot by High-Speed Multi Wire Saw
British Library Online Contents | 2014
|Multi-Wire Electrical Discharge Slicing for Silicon Carbide
British Library Online Contents | 2013
|Dynamic Analysis of Wafer Slicing by Using Multi Wire Saw
British Library Online Contents | 2010
|Multi-objective optimization for silicon wafer slicing using wire-EDM process
British Library Online Contents | 2015
|British Library Online Contents | 2012
|