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    Multi-objective optimization for silicon wafer slicing using wire-EDM process

    New search for: Dongre, Ganesh
    New search for: Zaware, Sagar
    New search for: Dabade, Uday
    New search for: Joshi, Suhas S.

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    Multi-objective optimization for silicon wafer slicing using wire-EDM process

    New search for: Dongre, Ganesh
    New search for: Zaware, Sagar
    New search for: Dabade, Uday
    New search for: Joshi, Suhas S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Multi-objective optimization for silicon wafer slicing using wire-EDM process

    New search for: Dongre, Ganesh
    New search for: Zaware, Sagar
    New search for: Dabade, Uday
    New search for: Joshi, Suhas S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Multi-objective optimization for silicon wafer slicing using wire-EDM process

    Contributors:

    Dongre, Ganesh (author) / Zaware, Sagar (author) / Dabade, Uday (author) / Joshi, Suhas S. (author)

    Published in:

    Materials science in semiconductor processing ; 39 ; 793-806

    Publication date:

    2015-01-01

    Size:

    14 pages

    ISSN:

    1369-8001

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.38152

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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