Invalidating mechanism of bis (3-sulfopropyl) disulfide (SPS) during copper via-filling process: Fid-Bau Portal

Invalidating mechanism of bis (3-sulfopropyl) disulfide (SPS) during copper via-filling process

Wang, W. / Li, Y. B. / Li, Y. L.

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Invalidating mechanism of bis (3-sulfopropyl) disulfide (SPS) during copper via-filling process

Wang, W. / Li, Y. B. / Li, Y. L.

Invalidating mechanism of bis (3-sulfopropyl) disulfide (SPS) during copper via-filling process

Wang, W. / Li, Y. B. / Li, Y. L.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Invalidating mechanism of bis (3-sulfopropyl) disulfide (SPS) during copper via-filling process

Contributors:

Wang, W. (author) / Li, Y. B. (author) / Li, Y. L. (author)

Published in:

APPLIED SURFACE SCIENCE ; 255 ; 4389-4392

Publication date:

2009-01-01

Size:

4 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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