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Intrinsic stress, mismatch strain, and self-assembly during deposition of thin films subjected to an externally applied force
Intrinsic stress, mismatch strain, and self-assembly during deposition of thin films subjected to an externally applied force
Intrinsic stress, mismatch strain, and self-assembly during deposition of thin films subjected to an externally applied force
Kim, S. H. (author) / Boyd, J. G. (author)
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 22 ; 2048-2055
2008-01-01
8 pages
Article (Journal)
English
DDC:
621
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