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    A study of mechanical and thermal properties of materials in electronic packaging: application of micro DIC

    New search for: Zhang, D.
    New search for: Lu, C.
    New search for: Lu, P.
    New search for: Arola, D.

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    A study of mechanical and thermal properties of materials in electronic packaging: application of micro DIC

    New search for: Zhang, D.
    New search for: Lu, C.
    New search for: Lu, P.
    New search for: Arola, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    A study of mechanical and thermal properties of materials in electronic packaging: application of micro DIC

    New search for: Zhang, D.
    New search for: Lu, C.
    New search for: Lu, P.
    New search for: Arola, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    A study of mechanical and thermal properties of materials in electronic packaging: application of micro DIC

    Contributors:

    Zhang, D. (author) / Lu, C. (author) / Lu, P. (author) / Arola, D. (author)

    Published in:

    INTERNATIONAL JOURNAL OF MATERIALS AND PRODUCT TECHNOLOGY ; 34 ; 200-213

    Publication date:

    2009-01-01

    Size:

    14 pages

    ISSN:

    0268-1900

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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