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Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application
Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application
Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application
Fang, Haoming (author) / Bai, Shu-Lin (author) / Wong, Ching Ping (author)
Composites.Part A, Applied science and manufacturing ; 100 ; 71-80
2017-01-01
10 pages
Article (Journal)
English
DDC:
620.11805
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