Electrodeposition of CoWP film:V. Structural and morphological characterisations: Fid-Bau Portal

Electrodeposition of CoWP film:V. Structural and morphological characterisations

Dulal, S. M. / Yun, H. J. / Shin, C. B. / Kim, C. K.

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Electrodeposition of CoWP film:V. Structural and morphological characterisations

Dulal, S. M. / Yun, H. J. / Shin, C. B. / Kim, C. K.

Electrodeposition of CoWP film:V. Structural and morphological characterisations

Dulal, S. M. / Yun, H. J. / Shin, C. B. / Kim, C. K.

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Document information

Title:

Electrodeposition of CoWP film:V. Structural and morphological characterisations

Contributors:

Dulal, S. M. (author) / Yun, H. J. (author) / Shin, C. B. (author) / Kim, C. K. (author)

Published in:

APPLIED SURFACE SCIENCE ; 255 ; 5795-5801

Publication date:

2009-01-01

Size:

7 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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