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    Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping

    New search for: Zhang, L.
    New search for: Ho, P.S.
    New search for: Aubel, O.
    New search for: Hennesthal, C.
    New search for: Zschech, E.

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    Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping

    New search for: Zhang, L.
    New search for: Ho, P.S.
    New search for: Aubel, O.
    New search for: Hennesthal, C.
    New search for: Zschech, E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping

    New search for: Zhang, L.
    New search for: Ho, P.S.
    New search for: Aubel, O.
    New search for: Hennesthal, C.
    New search for: Zschech, E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping

    Contributors:

    Zhang, L. (author) / Ho, P.S. (author) / Aubel, O. (author) / Hennesthal, C. (author) / Zschech, E. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 2757-2760

    Publication date:

    2011-01-01

    Size:

    4 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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