Experimental and modeling study of the thermal conductivity of SiCp/Al composites with bimodal size distribution: Fid-Bau Portal

Experimental and modeling study of the thermal conductivity of SiCp/Al composites with bimodal size distribution

Chu, K. / Jia, C. / Liang, X. / Chen, H. / Guo, H. / Yin, F. / Qu, X.

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Experimental and modeling study of the thermal conductivity of SiCp/Al composites with bimodal size distribution

Chu, K. / Jia, C. / Liang, X. / Chen, H. / Guo, H. / Yin, F. / Qu, X.

Experimental and modeling study of the thermal conductivity of SiCp/Al composites with bimodal size distribution

Chu, K. / Jia, C. / Liang, X. / Chen, H. / Guo, H. / Yin, F. / Qu, X.

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Check availability in my library

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Document information

Title:

Experimental and modeling study of the thermal conductivity of SiCp/Al composites with bimodal size distribution

Contributors:

Chu, K. (author) / Jia, C. (author) / Liang, X. (author) / Chen, H. (author) / Guo, H. (author) / Yin, F. (author) / Qu, X. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 44 ; 4370-4378

Publication date:

2009-01-01

Size:

9 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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