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    Interfacial fracture toughness of APS bond coat/substrate under high temperature

    New search for: Hongyu, Q.
    New search for: Xiaoguang, Y.
    New search for: Yamei, W.

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    Interfacial fracture toughness of APS bond coat/substrate under high temperature

    New search for: Hongyu, Q.
    New search for: Xiaoguang, Y.
    New search for: Yamei, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial fracture toughness of APS bond coat/substrate under high temperature

    New search for: Hongyu, Q.
    New search for: Xiaoguang, Y.
    New search for: Yamei, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Interfacial fracture toughness of APS bond coat/substrate under high temperature

    Contributors:

    Hongyu, Q. (author) / Xiaoguang, Y. (author) / Yamei, W. (author)

    Published in:

    INTERNATIONAL JOURNAL OF FRACTURE ; 157 ; 71-80

    Publication date:

    2009-01-01

    Size:

    10 pages

    ISSN:

    0376-9429

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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