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    The Study on the Surface Abrasion about Wafer Final Polishing

    New search for: Won, J.K.
    New search for: Lee, J.T.
    New search for: Lee, E.S.
    New search for: Guo, D.
    New search for: Wang, J.
    New search for: Jia, Z.
    New search for: Kang, R.
    New search for: Gao, H.
    New search for: Wang, X.

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    The Study on the Surface Abrasion about Wafer Final Polishing

    New search for: Won, J.K.
    New search for: Lee, J.T.
    New search for: Lee, E.S.
    New search for: Guo, D.
    New search for: Wang, J.
    New search for: Jia, Z.
    New search for: Kang, R.
    New search for: Gao, H.
    New search for: Wang, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The Study on the Surface Abrasion about Wafer Final Polishing

    New search for: Won, J.K.
    New search for: Lee, J.T.
    New search for: Lee, E.S.
    New search for: Guo, D.
    New search for: Wang, J.
    New search for: Jia, Z.
    New search for: Kang, R.
    New search for: Gao, H.
    New search for: Wang, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    The Study on the Surface Abrasion about Wafer Final Polishing

    Contributors:

    Won, J.K. (author) / Lee, J.T. (author) / Lee, E.S. (author) / Guo, D. / Wang, J. / Jia, Z. / Kang, R. / Gao, H. / Wang, X.

    Published in:

    Advances in Materials Manufacturing Science and Technology XIII Volume I Advanced Manufacturing Technology and Equipment, and Manufacturing Systems and Automation ; 147-152

    MATERIALS SCIENCE FORUM ; 626/627

    Publication date:

    2009-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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