Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Friction Characteristic of Wafer Surface in Chemical Mechanical Polishing

    New search for: Jia, Z. Y.
    New search for: Su, J. X.
    New search for: Jin, Z. J.
    New search for: Guo, D. M.
    New search for: Li, L. P.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.
    New search for: Baron, Y. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Friction Characteristic of Wafer Surface in Chemical Mechanical Polishing

    New search for: Jia, Z. Y.
    New search for: Su, J. X.
    New search for: Jin, Z. J.
    New search for: Guo, D. M.
    New search for: Li, L. P.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.
    New search for: Baron, Y. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Friction Characteristic of Wafer Surface in Chemical Mechanical Polishing

    New search for: Jia, Z. Y.
    New search for: Su, J. X.
    New search for: Jin, Z. J.
    New search for: Guo, D. M.
    New search for: Li, L. P.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.
    New search for: Baron, Y. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Friction Characteristic of Wafer Surface in Chemical Mechanical Polishing

    Contributors:

    Jia, Z. Y. (author) / Su, J. X. (author) / Jin, Z. J. (author) / Guo, D. M. (author) / Li, L. P. (author) / Tamaki, J. / Kuriyagawa, T. / Baron, Y. M.

    Published in:

    Advances in Abrasive Technology VIII ; 389-394

    KEY ENGINEERING MATERIALS ; 291/292

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Chemical-Assisted Mechanical Polishing of Diamond Film on Wafer

    Ho-Cheng, H. / Chen, C. C. | British Library Online Contents | 2006

    Influence of Polishing Parameters on Chemical Mechanical Polishing Processes of LiTaO~3 Wafer

    Yuan, H. / Wei, X. / Du, H. W. et al. | British Library Online Contents | 2006

    The Characteristic of Abrasive Particle in Chemical - Mechanical Polishing

    Tsai, H. J. / Chang, C. C. / Jeng, Y. R. et al. | British Library Online Contents | 2006

    Study on Chemical Mechanical Polishing Mechanism of LiTaO~3 Wafer

    Wei, X. / Yuan, H. / Du, H. W. et al. | British Library Online Contents | 2006

    Material removal model for chemical-mechanical polishing considering wafer flexibility and edge effects

    Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2004

    Back to top