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Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring

Nagai, T. / Sasajima, Y. / Onuki, J.

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Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring

Nagai, T. / Sasajima, Y. / Onuki, J.

Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring

Nagai, T. / Sasajima, Y. / Onuki, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring

Contributors:

Nagai, T. (author) / Sasajima, Y. (author) / Onuki, J. (author)

Published in:

MATERIALS TRANSACTIONS ; 50 ; 2373-2377

Publication date:

2009-01-01

Size:

5 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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