Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Use of a PECVD-PVD process for the deposition of copper containing organosilicon thin films on steel

    New search for: Daniel, A.
    New search for: Le Pen, C.
    New search for: Archambeau, C.
    New search for: Reniers, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Use of a PECVD-PVD process for the deposition of copper containing organosilicon thin films on steel

    New search for: Daniel, A.
    New search for: Le Pen, C.
    New search for: Archambeau, C.
    New search for: Reniers, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Use of a PECVD-PVD process for the deposition of copper containing organosilicon thin films on steel

    New search for: Daniel, A.
    New search for: Le Pen, C.
    New search for: Archambeau, C.
    New search for: Reniers, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Use of a PECVD-PVD process for the deposition of copper containing organosilicon thin films on steel

    Contributors:

    Daniel, A. (author) / Le Pen, C. (author) / Archambeau, C. (author) / Reniers, F. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 256 ; S82-S85

    Publication date:

    2009-01-01

    Size:

    S82-S85

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Use of a PECVD-PVD process for the deposition of copper containing organosilicon thin films on steel

    Daniel, A. / Le Pen, C. / Archambeau, C. et al. | British Library Online Contents | 2009

    Deposition of Ti-containing diamond-like carbon (DLC) films by PECVD technique

    Caschera, D. / Federici, F. / Kaciulis, S. et al. | British Library Online Contents | 2007

    Characteristics of PECVD GaN thin films

    Lee, C. H. / Chen, C. T. | British Library Online Contents | 1996

    Deposition of DLC Films onto Oxynitriding-Treated V4E High Vanadium Tool Steel through DC-Pulsed PECVD Process

    Chang, Shih-Hsien / Wu, Wei-Chen / Huang, Kuo-Tsung et al. | British Library Online Contents | 2017

    Effect of deposition temperature on polymorphous silicon thin films by PECVD: Role of hydrogen

    Hamui, L. / Monroy, B.M. / Kim, K.H. et al. | British Library Online Contents | 2016

    Back to top