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Use of a PECVD-PVD process for the deposition of copper containing organosilicon thin films on steel
Use of a PECVD-PVD process for the deposition of copper containing organosilicon thin films on steel
Use of a PECVD-PVD process for the deposition of copper containing organosilicon thin films on steel
Daniel, A. (Autor:in) / Le Pen, C. (Autor:in) / Archambeau, C. (Autor:in) / Reniers, F. (Autor:in)
APPLIED SURFACE SCIENCE ; 256 ; S82-S85
01.01.2009
S82-S85
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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