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    Crack initiation strength of an interface between a submicron-thick film and a substrate

    New search for: Van Truong, D.
    New search for: Kitamura, T.
    New search for: Van Thanh, V.

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    Crack initiation strength of an interface between a submicron-thick film and a substrate

    New search for: Van Truong, D.
    New search for: Kitamura, T.
    New search for: Van Thanh, V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Crack initiation strength of an interface between a submicron-thick film and a substrate

    New search for: Van Truong, D.
    New search for: Kitamura, T.
    New search for: Van Thanh, V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Crack initiation strength of an interface between a submicron-thick film and a substrate

    Contributors:

    Van Truong, D. (author) / Kitamura, T. (author) / Van Thanh, V. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 31 ; 1450-1456

    Publication date:

    2010-01-01

    Size:

    7 pages

    ISSN:

    0264-1275

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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