Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Crack initiation strength of an interface between a submicron-thick film and a substrate
Crack initiation strength of an interface between a submicron-thick film and a substrate
Crack initiation strength of an interface between a submicron-thick film and a substrate
Van Truong, D. (Autor:in) / Kitamura, T. (Autor:in) / Van Thanh, V. (Autor:in)
MATERIALS AND DESIGN -REIGATE- ; 31 ; 1450-1456
01.01.2010
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.0042
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