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Thermal properties of wood-derived copper-silicon carbide composites fabricated via electrodeposition

Pappacena, K. E. / Johnson, M. T. / Wang, H. / Porter, W. D. / Faber, K. T.

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Thermal properties of wood-derived copper-silicon carbide composites fabricated via electrodeposition

Pappacena, K. E. / Johnson, M. T. / Wang, H. / Porter, W. D. / Faber, K. T.

Thermal properties of wood-derived copper-silicon carbide composites fabricated via electrodeposition

Pappacena, K. E. / Johnson, M. T. / Wang, H. / Porter, W. D. / Faber, K. T.

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Access via TIB

Check availability in my library

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Document information

Title:

Thermal properties of wood-derived copper-silicon carbide composites fabricated via electrodeposition

Contributors:

Pappacena, K. E. (author) / Johnson, M. T. (author) / Wang, H. (author) / Porter, W. D. (author) / Faber, K. T. (author)

Published in:

COMPOSITES SCIENCE AND TECHNOLOGY ; 70 ; 478-484

Publication date:

2010-01-01

Size:

7 pages

ISSN:

0266-3538

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.118

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