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Thermal stability of ultrafine-grained copper during high speed micro-extrusion
Thermal stability of ultrafine-grained copper during high speed micro-extrusion
Thermal stability of ultrafine-grained copper during high speed micro-extrusion
Gu, C. F. (author) / Davies, C. H. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 527 ; 1791-1799
2010-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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