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    Part II: Developing tin-lead and lead-free solder pastes

    New search for: Bath, J.
    New search for: Garcia, R.
    New search for: Uchlda, N.

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    Part II: Developing tin-lead and lead-free solder pastes

    New search for: Bath, J.
    New search for: Garcia, R.
    New search for: Uchlda, N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Part II: Developing tin-lead and lead-free solder pastes

    New search for: Bath, J.
    New search for: Garcia, R.
    New search for: Uchlda, N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Part II: Developing tin-lead and lead-free solder pastes

    Contributors:

    Bath, J. (author) / Garcia, R. (author) / Uchlda, N. (author)

    Published in:

    ENGINEER IT ; 38-40

    Publication date:

    2010-01-01

    Size:

    3 pages

    ISSN:

    1991-5047

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.00285

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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