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    The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes

    New search for: Durairaj, R.
    New search for: Man, L. W.
    New search for: Ekere, N. N.
    New search for: Mallik, S.

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    The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes

    New search for: Durairaj, R.
    New search for: Man, L. W.
    New search for: Ekere, N. N.
    New search for: Mallik, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes

    New search for: Durairaj, R.
    New search for: Man, L. W.
    New search for: Ekere, N. N.
    New search for: Mallik, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes

    Contributors:

    Durairaj, R. (author) / Man, L. W. (author) / Ekere, N. N. (author) / Mallik, S. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 31 ; 1056-1062

    Publication date:

    2010-01-01

    Size:

    7 pages

    ISSN:

    0264-1275

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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