Diffusion bonding of TiAl using Ni/Al multilayers: Fid-Bau Portal

Diffusion bonding of TiAl using Ni/Al multilayers

Simões, S. n. / Viana, F. / Ventzke, V. / Koçak, M. / Sofia Ramos, A. / Teresa Vieira, M. / Vieira, M. F.

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Diffusion bonding of TiAl using Ni/Al multilayers

Simões, S. n. / Viana, F. / Ventzke, V. / Koçak, M. / Sofia Ramos, A. / Teresa Vieira, M. / Vieira, M. F.

Diffusion bonding of TiAl using Ni/Al multilayers

Simões, S. n. / Viana, F. / Ventzke, V. / Koçak, M. / Sofia Ramos, A. / Teresa Vieira, M. / Vieira, M. F.

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Document information

Title:

Diffusion bonding of TiAl using Ni/Al multilayers

Contributors:

Simões, S. n. (author) / Viana, F. (author) / Ventzke, V. (author) / Koçak, M. (author) / Sofia Ramos, A. (author) / Teresa Vieira, M. (author) / Vieira, M. F. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 45 ; 4351-4357

Publication date:

2010-01-01

Size:

7 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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