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    Dissolution of Voids during Compression Molding of SMC

    New search for: Lundstrom, T.S.
    New search for: Holmgren, A.

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    Dissolution of Voids during Compression Molding of SMC

    New search for: Lundstrom, T.S.
    New search for: Holmgren, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Dissolution of Voids during Compression Molding of SMC

    New search for: Lundstrom, T.S.
    New search for: Holmgren, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Dissolution of Voids during Compression Molding of SMC

    Contributors:

    Lundstrom, T.S. (author) / Holmgren, A. (author)

    Published in:

    JOURNAL OF REINFORCED PLASTICS AND COMPOSITES ; 29 ; 1826-1837

    Publication date:

    2010-01-01

    Size:

    12 pages

    ISSN:

    0731-6844

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1923

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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