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    Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface

    New search for: Tsukamoto, H.
    New search for: Dong, Z.G.
    New search for: Huang, H.
    New search for: Nishimura, T.
    New search for: Nogita, K.
    New search for: Nie, J.-F.
    New search for: Morton, A.

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    Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface

    New search for: Tsukamoto, H.
    New search for: Dong, Z.G.
    New search for: Huang, H.
    New search for: Nishimura, T.
    New search for: Nogita, K.
    New search for: Nie, J.-F.
    New search for: Morton, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface

    New search for: Tsukamoto, H.
    New search for: Dong, Z.G.
    New search for: Huang, H.
    New search for: Nishimura, T.
    New search for: Nogita, K.
    New search for: Nie, J.-F.
    New search for: Morton, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
    Title:

    Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface

    Contributors:

    Tsukamoto, H. (author) / Dong, Z.G. (author) / Huang, H. (author) / Nishimura, T. (author) / Nogita, K. (author) / Nie, J.-F. / Morton, A.

    Published in:

    PRICM7 PART 3 ; 2446-2449

    MATERIALS SCIENCE FORUM ; 654/656

    Publication date:

    2010-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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