A platform for research: civil engineering, architecture and urbanism
Nanoindentation measurements on Cu-Sn and Ag-Sn intermetallics formed in Pb-free solder joints
Nanoindentation measurements on Cu-Sn and Ag-Sn intermetallics formed in Pb-free solder joints
Nanoindentation measurements on Cu-Sn and Ag-Sn intermetallics formed in Pb-free solder joints
Chromik, R. R. (author) / Vinci, R. P. (author) / Allen, S. L. (author) / Notis, M. R. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 18 ; 2251-2261
2003-01-01
11 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2010
|Damage Mechanics Model for Solder/Intermetallics Interface Fracture Process in Solder Joints
British Library Online Contents | 2011
|Study of intermetallics formation in thick film solder joints
British Library Online Contents | 2002
|British Library Online Contents | 1999
|Thermomigration in lead-free solder joints
British Library Online Contents | 2008
|