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    Cu/Si interface fracture due to fatigue of copper film in nanometer scale

    New search for: Sumigawa, T.
    New search for: Murakami, T.
    New search for: Shishido, T.
    New search for: Kitamura, T.

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    Cu/Si interface fracture due to fatigue of copper film in nanometer scale

    New search for: Sumigawa, T.
    New search for: Murakami, T.
    New search for: Shishido, T.
    New search for: Kitamura, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Cu/Si interface fracture due to fatigue of copper film in nanometer scale

    New search for: Sumigawa, T.
    New search for: Murakami, T.
    New search for: Shishido, T.
    New search for: Kitamura, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Cu/Si interface fracture due to fatigue of copper film in nanometer scale

    Contributors:

    Sumigawa, T. (author) / Murakami, T. (author) / Shishido, T. (author) / Kitamura, T. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 527 ; 6518-6523

    Publication date:

    2010-01-01

    Size:

    6 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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