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Characterization of the interface adhesion of elastic-plastic thin film/rigid substrate systems using a pressurized blister test numerical model
Characterization of the interface adhesion of elastic-plastic thin film/rigid substrate systems using a pressurized blister test numerical model
Characterization of the interface adhesion of elastic-plastic thin film/rigid substrate systems using a pressurized blister test numerical model
MECHANICS OF MATERIALS ; 42 ; 908-915
2010-01-01
8 pages
Article (Journal)
English
DDC:
620.11
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