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Copper Electroplating Technology for Roughening of Copper Foil

Feng, S.-b. / Li, Z.-x. / Hu, F.-h. / Sun, L. / Wei, Y.-y.

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Copper Electroplating Technology for Roughening of Copper Foil

Feng, S.-b. / Li, Z.-x. / Hu, F.-h. / Sun, L. / Wei, Y.-y.

Copper Electroplating Technology for Roughening of Copper Foil

Feng, S.-b. / Li, Z.-x. / Hu, F.-h. / Sun, L. / Wei, Y.-y.

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Check availability in my library

Order at Subito €

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Document information

Title:

Copper Electroplating Technology for Roughening of Copper Foil

Contributors:

Feng, S.-b. (author) / Li, Z.-x. (author) / Hu, F.-h. (author) / Sun, L. (author) / Wei, Y.-y. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 43 ; 24-26

Publication date:

2010-01-01

Size:

3 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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