Microstructural stability of copper with antimony dopants at grain boundaries: experiments and molecular dynamics simulations: Fid-Bau Portal

Microstructural stability of copper with antimony dopants at grain boundaries: experiments and molecular dynamics simulations

Rajgarhia, R. K. / Saxena, A. / Spearot, D. E. / Hartwig, K. T. / More, K. L. / Kenik, E. A. / Meyer, H.

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Microstructural stability of copper with antimony dopants at grain boundaries: experiments and molecular dynamics simulations

Rajgarhia, R. K. / Saxena, A. / Spearot, D. E. / Hartwig, K. T. / More, K. L. / Kenik, E. A. / Meyer, H.

Microstructural stability of copper with antimony dopants at grain boundaries: experiments and molecular dynamics simulations

Rajgarhia, R. K. / Saxena, A. / Spearot, D. E. / Hartwig, K. T. / More, K. L. / Kenik, E. A. / Meyer, H.

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Document information

Title:

Microstructural stability of copper with antimony dopants at grain boundaries: experiments and molecular dynamics simulations

Contributors:

Rajgarhia, R. K. (author) / Saxena, A. (author) / Spearot, D. E. (author) / Hartwig, K. T. (author) / More, K. L. (author) / Kenik, E. A. (author) / Meyer, H. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 45 ; 6707-6718

Publication date:

2010-01-01

Size:

12 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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