Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing: Fid-Bau Portal

Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing

Gao, J. / Chen, J. / Liu, G. / Yan, Y. / Liu, X. / Huang, Z.

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Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing

Gao, J. / Chen, J. / Liu, G. / Yan, Y. / Liu, X. / Huang, Z.

Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing

Gao, J. / Chen, J. / Liu, G. / Yan, Y. / Liu, X. / Huang, Z.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

Title:

Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing

Contributors:

Gao, J. (author) / Chen, J. (author) / Liu, G. (author) / Yan, Y. (author) / Liu, X. (author) / Huang, Z. (author)

Published in:

WEAR -LAUSANNE- ; 270 ; 88-94

Publication date:

2010-01-01

Size:

7 pages

ISSN:

0043-1648

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11292

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