Subsurface damage in single-crystal silicon due to grinding and polishing: Fid-Bau Portal

Subsurface damage in single-crystal silicon due to grinding and polishing

Zarudi, I. / Zhang, L.

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Subsurface damage in single-crystal silicon due to grinding and polishing

Zarudi, I. / Zhang, L.

Subsurface damage in single-crystal silicon due to grinding and polishing

Zarudi, I. / Zhang, L.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Subsurface damage in single-crystal silicon due to grinding and polishing

Contributors:

Zarudi, I. (author) / Zhang, L. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE LETTERS ; 15 ; 586-587

Publication date:

1996-01-01

Size:

2 pages

ISSN:

0261-8028

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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