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    Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

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    Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

    New search for: Zhang, X.
    New search for: Guo, H.
    New search for: Yin, F.
    New search for: Fan, Y.
    New search for: Zhang, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

    New search for: Zhang, X.
    New search for: Guo, H.
    New search for: Yin, F.
    New search for: Fan, Y.
    New search for: Zhang, Y.

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Title:

    Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

    Contributors:

    Zhang, X. (author) / Guo, H. (author) / Yin, F. (author) / Fan, Y. (author) / Zhang, Y. (author)

    Published in:

    RARE METALS -BEIJING- ENGLISH EDITION ; 30 ; 94-98

    Publication date:

    2011-01-01

    Size:

    5 pages

    ISSN:

    1001-0521

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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