A platform for research: civil engineering, architecture and urbanism
Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications
Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications
Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications
RARE METALS -BEIJING- ENGLISH EDITION ; 30 ; 94-98
2011-01-01
5 pages
Article (Journal)
English
DDC:
669
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2007
|Microstructure and Adhesion of Diamond Composites
British Library Online Contents | 2012
|Interfacial properties and microstructure of multiwalled carbon nanotubes/epoxy composites
British Library Online Contents | 2009
|Diamond: Electronic Properties and Applications
TIBKAT | 1995
|