Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface: Fid-Bau Portal

Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface

Yang, M. / Li, M. / Wang, L. / Fu, Y. / Kim, J. / Weng, L.

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Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface

Yang, M. / Li, M. / Wang, L. / Fu, Y. / Kim, J. / Weng, L.

Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface

Yang, M. / Li, M. / Wang, L. / Fu, Y. / Kim, J. / Weng, L.

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Check availability in my library

Order at Subito €

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Document information

Title:

Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface

Contributors:

Yang, M. (author) / Li, M. (author) / Wang, L. (author) / Fu, Y. (author) / Kim, J. (author) / Weng, L. (author)

Published in:

MATERIALS LETTERS ; 65 ; 1506-1509

Publication date:

2011-01-01

Size:

4 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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