Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution: Fid-Bau Portal

Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution

Yokoyama, K. i. / Tsuji, D. / Sakai, J. i.

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Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution

Yokoyama, K. i. / Tsuji, D. / Sakai, J. i.

Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution

Yokoyama, K. i. / Tsuji, D. / Sakai, J. i.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution

Contributors:

Yokoyama, K. i. (author) / Tsuji, D. (author) / Sakai, J. i. (author)

Published in:

CORROSION SCIENCE ; 53 ; 3331-3336

Publication date:

2011-01-01

Size:

6 pages

ISSN:

0010-938X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.16205 / 620

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