Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation: Fid-Bau Portal

Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Yahaya, Muhamad Zamri / Ani, Fakhrozi Che / Samsudin, Zambri / Sahin, Salim / Abdullah, Mohd Zulkifly / Mohamad, Ahmad Azmin

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Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Yahaya, Muhamad Zamri / Ani, Fakhrozi Che / Samsudin, Zambri / Sahin, Salim / Abdullah, Mohd Zulkifly / Mohamad, Ahmad Azmin

Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Yahaya, Muhamad Zamri / Ani, Fakhrozi Che / Samsudin, Zambri / Sahin, Salim / Abdullah, Mohd Zulkifly / Mohamad, Ahmad Azmin

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Document information

Title:

Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Contributors:

Yahaya, Muhamad Zamri (author) / Ani, Fakhrozi Che (author) / Samsudin, Zambri (author) / Sahin, Salim (author) / Abdullah, Mohd Zulkifly (author) / Mohamad, Ahmad Azmin (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 669 ; 178-186

Publication date:

2016-01-01

Size:

9 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

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Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution

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