A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Thermal Stress Failures: Predictive Modeling Explains the Reliability Physics Behind Them
Suhir, E. (author)
ADVANCING MICROELECTRONICS ; 38 ; 12-23
2011-01-01
12 pages
Article (Journal)
English
DDC:
621.381
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