Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Stress Failures: Predictive Modeling Explains the Reliability Physics Behind Them
Suhir, E. (Autor:in)
ADVANCING MICROELECTRONICS ; 38 ; 12-23
01.01.2011
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.381
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Thermal Stress Failures in Electronics and Photonics: Physics, Modeling, Prevention
| British Library Online Contents | 2013
Profile - Manitowoc explains the power behind the Grove purchase.
Online Contents | 2002
Developing differences - Mark Hooper explains the thinking behind the LODIS project
| Online Contents | 2002
Interview - Aldo Ceresola explains the philosophy behind the changes at his company
Online Contents | 2006
New theory for what's behind built-up roofing failures
| Engineering Index Backfile | 1966