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    Effects of Processing Parameters in Jet Electroforming on Microstructure of Copper Electroforming Layer

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    New search for: Tian, Z.-j.
    New search for: Liu, Z.-d.
    New search for: Zhao, Y.-p.

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    Effects of Processing Parameters in Jet Electroforming on Microstructure of Copper Electroforming Layer

    New search for: Chen, J.-s.
    New search for: Tian, Z.-j.
    New search for: Liu, Z.-d.
    New search for: Zhao, Y.-p.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of Processing Parameters in Jet Electroforming on Microstructure of Copper Electroforming Layer

    New search for: Chen, J.-s.
    New search for: Tian, Z.-j.
    New search for: Liu, Z.-d.
    New search for: Zhao, Y.-p.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of Processing Parameters in Jet Electroforming on Microstructure of Copper Electroforming Layer

    Contributors:

    Chen, J.-s. (author) / Tian, Z.-j. (author) / Liu, Z.-d. (author) / Zhao, Y.-p. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING -HANGZHOU- ; 29 ; 513-516

    Publication date:

    2011-01-01

    Size:

    4 pages

    ISSN:

    1673-2812

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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