Predication of Wettability of Sn Droplet on Copper Plate by MEAM Method: Fid-Bau Portal

Predication of Wettability of Sn Droplet on Copper Plate by MEAM Method

Yang, J.G. / Cheng, H.T. / Fang, H.Y.

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Predication of Wettability of Sn Droplet on Copper Plate by MEAM Method

Yang, J.G. / Cheng, H.T. / Fang, H.Y.

Predication of Wettability of Sn Droplet on Copper Plate by MEAM Method

Yang, J.G. / Cheng, H.T. / Fang, H.Y.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Predication of Wettability of Sn Droplet on Copper Plate by MEAM Method

Contributors:

Yang, J.G. (author) / Cheng, H.T. (author) / Fang, H.Y. (author) / Niu, J. / Zhou, G.

Published in:

Physical and Numerical Simulation of Material Processing VI ; 775-779

MATERIALS SCIENCE FORUM ; 704/705

Publication date:

2012-01-01

Size:

5 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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