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    Effect of interface debonding on the thermal conductivity of microencapsulated-paraffin filled epoxy matrix composites

    New search for: Su, J.-F.
    New search for: Zhao, Y.-H.
    New search for: Wang, X.-Y.
    New search for: Dong, H.
    New search for: Wang, S.-B.

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    Effect of interface debonding on the thermal conductivity of microencapsulated-paraffin filled epoxy matrix composites

    New search for: Su, J.-F.
    New search for: Zhao, Y.-H.
    New search for: Wang, X.-Y.
    New search for: Dong, H.
    New search for: Wang, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of interface debonding on the thermal conductivity of microencapsulated-paraffin filled epoxy matrix composites

    New search for: Su, J.-F.
    New search for: Zhao, Y.-H.
    New search for: Wang, X.-Y.
    New search for: Dong, H.
    New search for: Wang, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of interface debonding on the thermal conductivity of microencapsulated-paraffin filled epoxy matrix composites

    Contributors:

    Su, J.-F. (author) / Zhao, Y.-H. (author) / Wang, X.-Y. (author) / Dong, H. (author) / Wang, S.-B. (author)

    Published in:

    COMPOSITES PART A ; 43 ; 325-332

    Publication date:

    2012-01-01

    Size:

    8 pages

    ISSN:

    1359-835X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.118

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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