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Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon
Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon
Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon
Goel, S. (author) / Luo, X.C. (author) / Reuben, R.L. (author) / Rashid, W.B. (author) / Sun, J.N. (author) / Morgan, M.N. / Shaw, A. / Mgaloblishvili, O.
2012-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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