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Numerical Computation and Analysis of Cutting Forces during Nanometric Scratching of Silicon Carbide
https://orcid.org/http://orcid.org/0000-0002-4175-7419
https://orcid.org/http://orcid.org/0000-0003-4082-7654
Silicon carbide (SiC) is widely used in the manufacture of space-based optical imaging systems, critical parts of microelectronic systems, reflective imaging systems, fibre optics communication systems, and automobiles. The mechanical processing of SiC is challenging due to its brittle nature. In the present study, a numerical model of nanometric scratching of difficult-to-machine SiC has been developed based on the finite element method to understand the ultra-precision machining process. The developed model was validated with the available experimental results. The cutting and thrust forces generated from the simulations were found in good agreement with the published experimental values. The simulation methodology and results would thus help to optimize the process parameters without carrying out expensive and tedious experiments.
Numerical Computation and Analysis of Cutting Forces during Nanometric Scratching of Silicon Carbide
https://orcid.org/http://orcid.org/0000-0002-4175-7419
https://orcid.org/http://orcid.org/0000-0003-4082-7654
Silicon carbide (SiC) is widely used in the manufacture of space-based optical imaging systems, critical parts of microelectronic systems, reflective imaging systems, fibre optics communication systems, and automobiles. The mechanical processing of SiC is challenging due to its brittle nature. In the present study, a numerical model of nanometric scratching of difficult-to-machine SiC has been developed based on the finite element method to understand the ultra-precision machining process. The developed model was validated with the available experimental results. The cutting and thrust forces generated from the simulations were found in good agreement with the published experimental values. The simulation methodology and results would thus help to optimize the process parameters without carrying out expensive and tedious experiments.
Numerical Computation and Analysis of Cutting Forces during Nanometric Scratching of Silicon Carbide
https://orcid.org/http://orcid.org/0000-0002-4175-7419
https://orcid.org/http://orcid.org/0000-0003-4082-7654
Silicon carbide (SiC) is widely used in the manufacture of space-based optical imaging systems, critical parts of microelectronic systems, reflective imaging systems, fibre optics communication systems, and automobiles. The mechanical processing of SiC is challenging due to its brittle nature. In the present study, a numerical model of nanometric scratching of difficult-to-machine SiC has been developed based on the finite element method to understand the ultra-precision machining process. The developed model was validated with the available experimental results. The cutting and thrust forces generated from the simulations were found in good agreement with the published experimental values. The simulation methodology and results would thus help to optimize the process parameters without carrying out expensive and tedious experiments.
Numerical Computation and Analysis of Cutting Forces during Nanometric Scratching of Silicon Carbide
J. Inst. Eng. India Ser. C
Barkachary, Borad M. (author) / Joshi, Shrikrishna N. (author)
2022-02-01
10 pages
Article (Journal)
Electronic Resource
English
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