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    Release of interfacial thermal stress and accompanying improvement of interfacial adhesion in carbon fiber reinforced epoxy resin composites: Induced by diblock copolymers

    New search for: Deng, S.
    New search for: Zhou, X.
    New search for: Fan, C.
    New search for: Lin, Q.

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    Release of interfacial thermal stress and accompanying improvement of interfacial adhesion in carbon fiber reinforced epoxy resin composites: Induced by diblock copolymers

    New search for: Deng, S.
    New search for: Zhou, X.
    New search for: Fan, C.
    New search for: Lin, Q.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Release of interfacial thermal stress and accompanying improvement of interfacial adhesion in carbon fiber reinforced epoxy resin composites: Induced by diblock copolymers

    New search for: Deng, S.
    New search for: Zhou, X.
    New search for: Fan, C.
    New search for: Lin, Q.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Release of interfacial thermal stress and accompanying improvement of interfacial adhesion in carbon fiber reinforced epoxy resin composites: Induced by diblock copolymers

    Contributors:

    Deng, S. (author) / Zhou, X. (author) / Fan, C. (author) / Lin, Q. (author)

    Published in:

    COMPOSITES PART A ; 43 ; 990-996

    Publication date:

    2012-01-01

    Size:

    7 pages

    ISSN:

    1359-835X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.118

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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