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Diffusion-fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing

Ri, S. / Saka, M.

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Diffusion-fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing

Ri, S. / Saka, M.

Diffusion-fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing

Ri, S. / Saka, M.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Diffusion-fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing

Contributors:

Ri, S. (author) / Saka, M. (author)

Published in:

MATERIALS LETTERS ; 79 ; 139-141

Publication date:

2012-01-01

Size:

3 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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