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    Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer

    New search for: Qiu, W. Q.
    New search for: Liu, Z. W.
    New search for: He, L. X.
    New search for: Zeng, D. C.
    New search for: Mai, Y. W.

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    Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer

    New search for: Qiu, W. Q.
    New search for: Liu, Z. W.
    New search for: He, L. X.
    New search for: Zeng, D. C.
    New search for: Mai, Y. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer

    New search for: Qiu, W. Q.
    New search for: Liu, Z. W.
    New search for: He, L. X.
    New search for: Zeng, D. C.
    New search for: Mai, Y. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer

    Contributors:

    Qiu, W. Q. (author) / Liu, Z. W. (author) / He, L. X. (author) / Zeng, D. C. (author) / Mai, Y. W. (author)

    Published in:

    MATERIALS LETTERS ; 81 ; 155-157

    Publication date:

    2012-01-01

    Size:

    3 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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