Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer
Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer
Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)-diamond composite interlayer
Qiu, W. Q. (Autor:in) / Liu, Z. W. (Autor:in) / He, L. X. (Autor:in) / Zeng, D. C. (Autor:in) / Mai, Y. W. (Autor:in)
MATERIALS LETTERS ; 81 ; 155-157
01.01.2012
3 pages
Aufsatz (Zeitschrift)
Englisch
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