The Formation Mechanism of Ni-Based Ohmic Contacts to 4H-n-SiC: Fid-Bau Portal

The Formation Mechanism of Ni-Based Ohmic Contacts to 4H-n-SiC

Kuchuk, A.V. / Kladko, V.P. / Golaszewska, K. / Guziewicz, M. / Wzorek, M. / Kaminska, E. / Piotrowska, A.

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The Formation Mechanism of Ni-Based Ohmic Contacts to 4H-n-SiC

Kuchuk, A.V. / Kladko, V.P. / Golaszewska, K. / Guziewicz, M. / Wzorek, M. / Kaminska, E. / Piotrowska, A.

The Formation Mechanism of Ni-Based Ohmic Contacts to 4H-n-SiC

Kuchuk, A.V. / Kladko, V.P. / Golaszewska, K. / Guziewicz, M. / Wzorek, M. / Kaminska, E. / Piotrowska, A.

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Check availability in my library

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Document information

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Document information

Title:

The Formation Mechanism of Ni-Based Ohmic Contacts to 4H-n-SiC

Contributors:

Kuchuk, A.V. (author) / Kladko, V.P. (author) / Golaszewska, K. (author) / Guziewicz, M. (author) / Wzorek, M. (author) / Kaminska, E. (author) / Piotrowska, A. (author)

Published in:

MATERIALS SCIENCE FORUM ; 717/720 ; 833-836

Publication date:

2012-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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