A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Packaging Technologies for 500^oC SiC Electronics and Sensors
Packaging Technologies for 500^oC SiC Electronics and Sensors
Packaging Technologies for 500^oC SiC Electronics and Sensors
Chen, L.Y. (author) / Johnson, R.W. (author) / Neudeck, P.G. (author) / Beheim, G.M. (author) / Spry, D.J. (author) / Meredith, R.D. (author) / Hunter, G.W. (author)
MATERIALS SCIENCE FORUM ; 717/720 ; 1033-1036
2012-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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