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Transient thermal fracture and crack growth behavior in brittle media based on non-Fourier heat conduction
Transient thermal fracture and crack growth behavior in brittle media based on non-Fourier heat conduction
Transient thermal fracture and crack growth behavior in brittle media based on non-Fourier heat conduction
Chang, D. M. (author) / Wang, B. L. (author)
ENGINEERING FRACTURE MECHANICS ; 94 ; 29-36
2012-01-01
8 pages
Article (Journal)
English
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