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A platform for research: civil engineering, architecture and urbanism
Mixed-mode crack initiation at the edge of Cu/Si interface due to nanoscale stress concentration
Mixed-mode crack initiation at the edge of Cu/Si interface due to nanoscale stress concentration
Mixed-mode crack initiation at the edge of Cu/Si interface due to nanoscale stress concentration
Kishimoto, K. (author) / Yan, Y. (author) / Sumigawa, T. (author) / Kitamura, T. (author)
ENGINEERING FRACTURE MECHANICS ; 96 ; 72-81
2012-01-01
10 pages
Article (Journal)
English
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